For decades, materials developers and formulators have used common, industry-standard measurement tools for assessing a given material’s properties and characteristics to provide some indication of performance.
Concepts from the textile industry may soon infiltrate thermal management in advanced packaging, in the form of manufactured spun threads and felted mats composed of single-wall carbon nanotubes (CNTs).
Advanced packaging is a dynamic sector of the semiconductor device manufacturing realm, as evidenced in the breadth of back-end and final assembly-and-test products on display at this year’s SEMICON West exhibition, held July 16-19 at the Moscone Center in San Francisco, CA.
Greetings from the Constitution State. For my first contribution to this publication - since developments in new packaging technology have failed to keep pace with Moore’s Law - I chose to consider industry consortia’s role in accelerating the rate of advancement in device packaging.
Fluxes - the brownish, fairly liquid material that allows molten solders to wet onto other metal surfaces - have come a long way from their rather primitive SMT forbears in solder paste, wave soldering, and rework to fulfill diverse needs in the semiconductor market.