Table of Contents
Solid State Technology
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Departments
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Editorial
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BiTS and Pieces
The snow in New England was turning gray. Even skiing had lost its appeal.
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BiTS and Pieces
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Advanced Packaging Road Show
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Welcome to Nerdvana!
We had a great turnout for our visit to Vectron International, in Hudson, NH.
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Welcome to Nerdvana!
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News
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AP Interview: Ann Witvrouw, manager, MEMS integration research program, IMEC
Advanced Packaging talked with IMEC’s Ann Witvrouw about recent developments in MEMS and CMOS processing, and how the technology could lead to advanced packaging techniques across the spectrum of MEMS structures.
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Customer is King at APEX/IPC Printed Circuits Expo
In the electronics industry, the road to success is no longer paved only with state-of-the-art equipment, technologies, or materials.
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AP Interview: Ann Witvrouw, manager, MEMS integration research program, IMEC
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Industry Voices
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Wafer Dicing and Thinning
If you had told me seven years ago that the industry would consider spending around $30 million for lithography tools (immersion 193 nm), I would have laughed out loud.
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Wafer Dicing and Thinning
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Notable Developments
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Innovative Method for Bonding and Interconnect: A 3D Subsystem Solution
Novel wafer-level 3D technologies will enable cell phone and other mobile equipment designers to achieve greater circuit density and/or significant cost savings, versus designs that make use of chips in traditional leadframe packages.
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Innovative Method for Bonding and Interconnect: A 3D Subsystem Solution
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Editorial board
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Doesn’t Happen Often
Nearly a year after the presentation of “A Case for Socket Reuse,” by Paul Gaschke of IBM, at the 2006 Burn-in and Test Socket (BiTS) Workshop, I wondered whether compression-mount sockets (which enabled the socket reuse he described) were seeing more widespread acceptance and application by users, and being added to suppliers’ product portfolios.
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Doesn’t Happen Often
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Trade Show Floor
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The Customer Is King at APEX/IPC Printed Circuits Expo 2007
In the electronics industry, the road to success is no longer paved only with state-of-the-art equipment, technologies, or materials.
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The Customer Is King at APEX/IPC Printed Circuits Expo 2007
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Features
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Cover Story
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Nanobump Flip Chips: Realizing the Advantages
While research in nano-transistors and nanotube wiring has been widely publicized, few seem to realize that a less glamorous application of nanotechnology in microelectronics device packaging appears closer to commercial reality.
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Nanobump Flip Chips: Realizing the Advantages
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Wafer-Level Packaging
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Advanced Ceramic Heaters
Two common processes used to attach die to the pad or cavity of the package’s support structure are adhesive and eutectic die attach.
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Advanced Ceramic Heaters
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Cleaning
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Cleaning with Aqueous TMAH: An Environmentally Friendly Alternative
Conductive paste screening on green sheet through a mask is a common technique to delineate desired circuitry for ceramic modules.
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Cleaning with Aqueous TMAH: An Environmentally Friendly Alternative
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The Back-end Process
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Die-attach Materials and Processes
The die-attach layer has two main functions: mechanical fixation of the die on its substrate, and dissipation of heat generated in the die. Especially in power and high-power applications, generated heat density is high.
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Die-attach Materials and Processes
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Editors' Picks
TOP BLOG POSTS
Intel Foundries MEMS for Fuel Cell Start-up Nectar
IFTLE 134 SEMI 3D European Summit – Is the Wide IO Driver Dead?
EUV source roadmaps: Physics vs Engineering
Intel details 22nm trigate SoC process at IEDM
IFTLE 128: RTI 3D ASIP Part 1; Lester the Lightbulb update
Questions and answers on FD-SOI
GlobalFoundries takes on Intel with 14nm finFET “eXtreme Mobility” process
LIVE NEWS FEED
Advanced Packaging Recent Articles
Packaging Topics
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NEW PRODUCTS
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3M announces QDEF; to bring 50% more color to LCD devices
May 21, 2013
3M announced today it is in the final stages of scale-up for its new 3M Quantum Dot Enhancement Film (QDEF). The new film allow...
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COMSOL Multiphysics 4.3b offers new additions to simulation platform
May 16, 2013
COMSOL Inc., a multiphysics simulator software developer, recently announced the release of major new additions to the COMSOL s...
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Spectra-Physics introduces industrial picosecond laser
May 10, 2013
Spectra-Physics, a Newport Corporation brand, introduces Spirit ps 1040-10, an industrial-grade picosecond laser for precision ...
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Multitest announces ecoAmp for high-power applications
May 8, 2013
Multitest announces that its ecoAmp high power Kelvin contactor successfully passed a challenging evaluation for an automotive ...
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