SINGAPORE - In a bid for the mobile handset market, STATS ChipPAC developed a method of stacking 3-D packages, creating a package-on-package (PoP) with up to seven stacked die.
Attendees at the 8th Annual Burn-in Test and Sockets Workshop (BiTS), March 11-14 in Mesa, AZ, are invited to Advanced Packaging’s Meet the Press, March 12th at 5pm to learn about general market trends in the sockets industry.
SEOUL, South Korea- Synova received tool orders from a Korea-based organic LED (OLED) manufacturer and a U.S.-based semiconductor manufacturer’s Korea facility.
The need for system-size reduction, high-performance interconnects, and heterogeneous integration of true system-on-chip (SoC) is driving the packaging world towards 3-D chip integration.
t the 2007 Consumer Electronics Show (CES), convergence, or the merging of PCs, TVs, cell phones, and other devices that enable access to diverse and growing content, was a key theme.
Though the basic requirement of sockets remains unchanged - making a stable electrical contact from the device to the PCB - the future holds even more demands on this important electrical/mechanical device.
The term “nanotechnology” is no longer new to most of us, thanks, in part, to the media. Developments recently made to open-type X-ray sources and X-ray imaging detectors may provide an end-user with the ability to image features in the nanometer range.
anufacturers and OEMs need a package-level cooling solution that provides cooling in close proximity to the chip, to cool hot spots and smooth out non-uniform power dissipation.
