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Dresden Factory Aims to Commercialize e-Reading
CAMBRIDGE, U.K. - Plastic Logic, which produces plastic substrates, garnered funding from a variety of equity sources to open a factory for commercial production of plastic electronics, specifically, the flexible active-matrix display modules of electronic readers.
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Proposed Consortium Seeks to Improve TIMs
BINGHAMTON, NY and ATLANTA - The Packaging Research Center (PRC) at the Georgia Institute of Technology (Georgia Tech) in Atlanta is partnering with Binghamton University, NY, to develop and promote a possible industry consortium addressing thermal interface materials (TIMs).
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CoorsTek Acquires Ceramic Wire-bond Company
GOLDEN, CO - Ceramics supplier and component manufacturer CoorsTek, acquired Gaiser Tool Company (Ventura, CA), a precision-tooling manufacturer of ceramic capillaries for high-reliability wire bonds.
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Connector Company Acquires Packaging Technology
PARIS - Souriau S.A.S., controlled by Sagard Private Equity Partners, signed a binding agreement to acquire U.S. operations of Pacific Aerospace & Electronics Inc. (PA&E).
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Endicott Interconnect Appoints Director for Global Accounts
ENDICOTT, NY - Warren Dannelly became director of sales, global accounts, for Endicott Interconnect Technologies, Inc., reporting to Michael Hills, senior VP of account services.
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Report: RFID - A Tale of Four Continents
CAMBRIDGE, U.K. - Reporting on the usage and volume of radio-frequency identification (RFID) tags, IDTechEx’s “RFID - A Tale of Four Continents,” examines data from North America, East Asia, Europe, and Australasia. IDTechEx found North America to be the largest RFID market in value, tag volume, and case studies, with the U.S. being the primary driver.
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Datacon Appoints India Rep
Datacon Technology GmbH named H. Fillunger & Co., Pvt. Ltd., sales representative in India. H. Fillunger, headquartered in Pune, India, also operates in Mumbai, an industrial center; Bangalore; and New Delhi, the capital. Datacon noted that the country’s market for electronics manufacturing equipment is rapidly expanding.
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APEX Commemorates 50 Years of IPC
LOS ANGELES - IPC Printed Circuits Expo/APEX/Designers Summit, February 18-22 in Los Angeles, will host the 50th anniversary celebration of the IPC - Association Connecting Electronic Industries, as well as various other celebratory and informative events.
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USDC Promotes FPO Adoption
SAN JOSE, CA - The U.S. Display Consortium (USDC) board of directors will launch an initiative to promote flexible, printed, and organic (FPO) electronics, providing services to industry, academia, and government sectors with the aim of developing and expanding the FPO electronics sector and drafting a pertinent technology roadmap.
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Merger Consolidates Prototyping Services
PLANO, TX - A merger between CV Inc. Business Solutions, FIB-X, Microtech Analytical Labs LP (MAL), and Fast Semiconductor, Inc. (FAST Semi), has created a full-scale prototyping house for chip-scale, flip chip, BGA, and QFN packages, with bumping and wire-bonding, assembly, failure analysis, design debug, and other packaging services.
