It wasn’t exactly the Roadshow, but I visited a fascinating start-up company and spoke with Arthur Chait, CEO; and Anwar Mohammed, VP of manufacturing and operations, about EoPlex Technologies, headquartered in Redwood City, CA.
KALISPELL, MT - Through-silicon vias (TSVs) are pivotal in thermally conscious packaging, and a budding consortium pledges to address the technical and cost issues of creating 3-D interconnects using TSV technology for chip stacking and MEMS/sensors packaging.
AUSTIN, TX - Freescale Semiconductor announced they have shipped over 30 million high-power laterally diffused metal oxide semiconductor (LDMOS) radio frequency (RF) transistors in over-molded plastic packages.
MEMS is an enabling technology allowing for the development of smart products, augmenting the computational ability of microelectronics with the perception and control capabilities of microsensors and microactuators and expanding the space of possible designs and applications.
Semiconductor assembly and packaging process engineers routinely face pressures of evolving technology requirements such as lead-free compliance, product introductions, and customer demands for quality.