Table of Contents

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  • Departments

    • Editorial

    • Advanced Packaging Road Show

      • We love New York!
        Our first stop in New York was to Endicott Interconnect, where we learned about organic build-up substrates.

    • News

      • Intel Begins Restructuring
        SANTA CLARA, CA - In an overview of its restructuring plan for the long-term future, Intel detailed reductions in workforce, merchandising expenses, capital, and materials.
      • Peptides, Carbon Nanotubes Team Up
        TEMPE, AZ - Motorola Labs and Arizona State University (ASU) have co-developed a coating process that allows chemical-detecting peptides to alert single-walled carbon nanotubes (SWNTs) to the presence of heavy-metal ions at the parts-per-trillion level.
      • Tessera and Flextronics Sign Licensing Agreement for Shellcase CF
        SAN JOSE, CA - Further paving the way into the consumer optics arena, Tessera announced the first licensing agreement for their wafer-level image sensor packaging technology, Shellcase CF, to Flextronics International Ltd.
      • SMIC Forms Design Partnerships
        SHANGHAI, China - Verisilicon Holdings Co., Ltd., an ASIC design foundry, semiconductor library, and intellectual property (IP) provider, along with Semiconductor Manufacturing International Corporation (SMIC), will release a standard design platform (SDP) for 0.13-μm low-leakage processes.
      • Actel Appoints Nordic FAE
        MOUNTAIN VIEW, CA - Actel Europe announced the addition of Rouzbeh Hosseinalikhani as a field applications engineer (FAE) to its Nordic and Baltic regions support staff.
      • Thin-film Batteries Attract Funding
        GOLDEN, CO - To build high-volume manufacturing facilities for its proprietary thin-film batteries, Infinite Power Solutions (IPS) attracted funding from existing and new corporate investors.

    • Industry Voices

      • Lead-free Impact on X-ray Inspection
        With the July 2006 deadline for the European Union’s (EU’s) RoHS and WEEE directives past, it’s interesting to observe the long-term impact of lead-free implementation upon X-ray inspection.

    • Notable Developments

    • New Products
      Dage’s computerized tomography (CT) option for digital X-ray inspection systems uses a digital geometric process to generate a 3-D image model from a series of individual 2-D X-ray image “slices” taken around a single axis of rotation.

    • Editorial board

      • Solid-state Memory Growth for Packaging
        The removable solid-state storage (RS3) market posted strong growth in 2005, as consumer demand for flash cards and universal serial bus (USB) flash drives continued.

  • Features

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