Table of Contents

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  • Departments

  • Features

    • Cover Story

      • Advances in MEMS Packaging
        The microelectromechanical systems (MEMS) component market size is forecasted to continue growing over the next few years. This article presents design considerations to provide a better understanding of the unique challenges facing MEMS packaging engineers, when compared to traditional IC packaging. Automatic MEMS assembly requires optimized equipment and processes.
    • Cooling IC Packages in Restricted Enclosures
      More ICs are being used in tighter spaces and increasing numbers of ICs are approaching or exceeding their operating temperature limits.
    • Trends in Wafer-level Packaging of MEMS
      Microelectromechanical systems (MEMS) are miniaturized systems with electrical and non-electrical components.
    • Ultraviolet Laser-based MOEMS and MEMS Micromachining
      Ultraviolet (UV) laser micromachining of microelectromechanical systems (MEMS) and micro-optoelectromechanical systems (MOEMS) is emerging as a viable, and often preferable, alternative to wet processing and other methods, thanks to its speed, accuracy and simplicity.

    • The Back-end Process

      • Die Attach in Lead Frame Packages: Step 4
        Although much of the buzz in the industry surrounds newer high-tech packages such as ball grid array (BGA), chip scale packages (CSP) and flip chips, the foundation of modern electronics is the lead frame package.

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