The microelectromechanical systems (MEMS) component market size is forecasted to continue growing over the next few years. This article presents design considerations to provide a better understanding of the unique challenges facing MEMS packaging engineers, when compared to traditional IC packaging. Automatic MEMS assembly requires optimized equipment and processes.
Ultraviolet (UV) laser micromachining of microelectromechanical systems (MEMS) and micro-optoelectromechanical systems (MOEMS) is emerging as a viable, and often preferable, alternative to wet processing and other methods, thanks to its speed, accuracy and simplicity.
Although much of the buzz in the industry surrounds newer high-tech packages such as ball grid array (BGA), chip scale packages (CSP) and flip chips, the foundation of modern electronics is the lead frame package.