Table of Contents
Solid State Technology
-
Departments
-
Editorial
-
Twists and Turns
It's difficult to tell from industry statistics just where the electronics industry is heading, but the shifts and changes in personnel and real estate are more telling than the numbers.
-
Twists and Turns
-
News
-
Industry Voices
-
Meeting the Challenges of the SATS Industry
Toward the end of August, the investment community was speculating that another downturn or inventory adjustment was upon us.
-
Meeting the Challenges of the SATS Industry
-
Packaging Trends
-
Subcontractor Update: Caution Follows Solid Q2
The financial reports for the major assembly and test subcontractors were quite positive in the first quarter of 2004, but those numbers don't tell the whole story.
-
Subcontractor Update: Caution Follows Solid Q2
-
Notable Developments
-
Advances in Bioelectronics Lead to Retinal Prosthesis
Chronically implantable retinal prostheses currently are under development to restore useful vision to blind patients with degenerative retinal diseases such as age-related macular degeneration and retinitis pigmentosa.
-
Advances in Bioelectronics Lead to Retinal Prosthesis
-
New Products
-
Editorial board
-
Technology Drivers Still Changing the Packaging Industry
Those involved in the packaging industry are quite familiar with two key technology drivers: Moore's Law (which dictates that the number of transistors will double in an IC every 24 months), and the increasing need to pack more capability (MIPs, Mbytes, GB/sec) into less space.
-
Technology Drivers Still Changing the Packaging Industry
-
-
Features
-
Cover Story
-
Flip Chip Bonding: Flexible Circuit Devices
Designed for Biomedical Applications
-
Flip Chip Bonding: Flexible Circuit Devices
-
The Right Logic Package: Benefits for Handheld Electronics
A PHYSICAL COMPARISON OF SINGLE- AND DUAL-GATE LOGIC
-
The Socket Response to Current Packaging and Test Trends
ADVANCES IN SPRING PROBE TECHNOLOGY DECREASE COST OF TEST SOCKET DESIGN
-
Novel Advanced Interconnects
ACHIEVING HIGH DENSITY PACKAGING AND INTERCONNECT
-
The Back-end Process
-
Step 10: Encapsulation Materials, Processes and Equipment
The electronic package might appear to be just a tiny black container for holding the chip, but it really is a sophisticated system when we consider the tasks to be accomplished, and under extreme conditions.
-
Step 10: Encapsulation Materials, Processes and Equipment
-
Editors' Picks
TOP BLOG POSTS
Intel Foundries MEMS for Fuel Cell Start-up Nectar
IFTLE 134 SEMI 3D European Summit – Is the Wide IO Driver Dead?
EUV source roadmaps: Physics vs Engineering
Intel details 22nm trigate SoC process at IEDM
IFTLE 128: RTI 3D ASIP Part 1; Lester the Lightbulb update
Questions and answers on FD-SOI
GlobalFoundries takes on Intel with 14nm finFET “eXtreme Mobility” process
LIVE NEWS FEED
Advanced Packaging Recent Articles
Packaging Topics
| Materials |
NEW PRODUCTS
|
Spectra-Physics introduces industrial picosecond laser
May 10, 2013
Spectra-Physics, a Newport Corporation brand, introduces Spirit ps 1040-10, an industrial-grade picosecond laser for precision ...
|
|
Multitest announces ecoAmp for high-power applications
May 8, 2013
Multitest announces that its ecoAmp high power Kelvin contactor successfully passed a challenging evaluation for an automotive ...
|
|
EV Group rolls out EVG120 processing system
May 7, 2013
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, t...
|
|
Quartz Imaging introduces automated measurement for semiconductor images
April 30, 2013
It can be very time-consuming for engineers to measure the various features of an X-SEM image of a semiconductor device. |
