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Benchtop Lead Attach Machine
Die-Tech's Model 3005 attaches single in-line placement leadframes to substrates and is an alternative to hand-tooling. Ideal for small assembly houses, the machine includes a handload inserter, pressure pad, lead feed, pin removal punch and carrier cut-off punch. The basic tooling system accommodates a wide range of substrate sizes, from 0.250- to 4.0-in. long. According to the company, typical throughput is approximately 800 to 1,200 packages per hour. Die-Tech, York Haven, Pa.
InP Wafer and Wafer Fragment Processor
A new vacuum-operated tooling system handles InP wafers and wafer fragments in cleaning and wet processing applications. Available in stainless steel for solvents and plastic for acids and base solutions, this tooling system can be installed on either robotic or manual load systems. Applications include metal lift-off, resist stripping, spray etching and cleaning. A full selection of sprays, dispensers, and high-performance nozzles and brushes are available, with parameters controlled by Windows-based software. Solid State Equipment Corp., Horsham, Pa.
Vecomulti electroformed stencils make it possible to vary the amount of solder paste deposited in different areas of a PCB by varying the thickness of the stencil. According to the company, this can reduce the number of rejects caused by the deposition of improper amounts of paste or material. The stencils are available in thicknesses of 100 to 275 microns. The maximum sheet size (740 x 600 mm) fits most printing machines. Stork Veco International Inc., Bedford, Mass.
CAD Conversion Program
The latest version of MYDATA Automation's CAD conversion program includes new features to simplify CAD file conversion. A wizard system assists users through a step-by-step process to create control files when using new CAD file types. When a file is created, it can be transferred through a customer's network and imported into a directory on a machine or server. A graphical viewer shows a visual representation of the converted PCB that includes reference points, which ensure accurate data matching. MYDATA Automation Worldwide, Peabody, Mass.
New Stencil Cleaner
Alpha Metals has added to its Hydrex line of stencil cleaners. Hydrex AC, A-Plus and SP are VOC-free, neutral pH, aqueous cleaning agents formulated to remove raw solder paste and uncured SMD adhesives from stencils and misprinted circuit boards. Alpha Metals, Jersey City, N.J.
AMETEK Process Instruments has developed an oxygen analyzer for rapid thermal processing wafer fabrication systems. The Dycor CG 1100 RTP system uses rapid heating cycles to perform high-temperature processes traditionally done by slow-heating batch furnace technologies. The technology is well-suited for both 200-mm and 300-mm wafers. Specific features include a zirconium oxide sensor, electronic flow control that allows for a range of operating pressures and a wide detection range. AMETEK Process Instruments, Pittsburgh, Pa.
Needle Cleaning Kit
A needle kit is available for DL Technology's custom manufacturing needles. To prolong the effective life of needles, the kit helps users clean material residue from internal surfaces of stainless steel needles. DL Technology, Lawrence, Mass.
Machinable Alumina Ceramic
A bisque-fired, machinable ceramic is available in various rod and plate sizes for use in high-temperature industrial applications (up to 1,430°C). Aremcolox 502-1400-BF is a low-density, 96-percent pure alumina ceramic that can be machined using conventional high-speed hardened steel tools. The ceramic enables end-users to produce prototype electrical insulators and high-temperature brazing without having to use diamond tools for machining. Properties include a compressive strength of 9,000 psi, a flexural strength of 4,000 psi and a dielectric strength of 80 volts per mil. Aremco Products Inc., Valley Cottage, N.Y.
Tra-Con has introduced Tra-Bond GA47-2LV low-viscosity adhesive for guidance instrument applications. It is available pre-mixed and frozen or in special packaging at room temperature. Tra-Con, Bedford, Mass.
Automated Modeling Program
Ansoft has added to its family of Signal Integrity analysis software tools. ParICs offers automation, design flexibility and ease-of-use for modeling a large number of different packaging types, including plastic quad flat packs, thin small-outline packages, plastic leaded chip carriers, dual in-line packages, small-outline integrated circuits (SOIC) and SOICs with J-bend leads. A full-wave finite element electromagnetic simulator enables engineers to design three-dimensional, high-frequency structures, such as connectors, IC packaging and antennas, in cellular telephones, broadband communication systems and microwave circuits. Ansoft, Pittsburgh, Pa.
Alphasem offers a new 300-mm platform system that conducts wafer handling with an adapter ring system and allows for quick changeover to different wafer sizes. The Swissline 9020 series also includes a new vision engine integrated into a user-friendly, graphic control interface. Alphasem, Berg, Switzerland.
The 1500 Series rework station allows for easy upgrades and good process control. It is able to accommodate both new and existing component packages. Central to the performance of the semi-automatic series is a focused infrared technology that allows users to quickly and safely solder and desolder a number of packages without overheating the components, adjacent devices or board substrate. PDR SMT/BGA Rework Solutions, a division of Eurotec Industries, Crawley, West Sussex, U.K.
Dispensing System for PCB Assembly
The Century 718 SMT Dispensing System for the dispensing of surface mount adhesive, solder paste and conductive adhesive is designed to service both medium- and high-mix production operations. It is available in two configurations. The first includes Asymtek's non-contact DispenseJet valve. It is a cost-effective system that handles adhesive dispensing throughput of up to 20,000 dots per hour and is optimized for standard surface mount adhesives. The system can also be configured with the company's DV-7000 Heli-flow rotary positive displacement pump for solder paste and conductive adhesive dispensing. Asymtek, Carlsbad, Calif.
New Package Line
StratEdge now offers a full line of SONET (Synchronous Optical Network) semiconductor packages. These ceramic, glass and metal-based packages are used in the fiberoptics market for packaging a variety of semiconductors used in broadband topologies. They maintain the integrity and electrical properties of high-frequency components while providing thermal management where necessary, which are critical issues for semiconductors designed for OC-48, OC-192 and OC-768 applications. StratEdge, San Diego, Calif.
Peel Force Tester
The Peel Back Force Tester measures the peel force strength of cover tape on SMT component carrier packaging to ensure consistent carriers for customers using SMT pick-and-place machines. The system includes a comprehensive software package to users to analyze and record minimums and maximums, average peel back force, speed, standard deviation and cpk data. The system strain gauge features a constant LCD readout and is capable of 5,000 samples per second. GPD Global, Grand Junction, Colo.
Wafer Scale CSP
A new wafer-scale chip scale package is ideal for RF and wireless applications. The Xtreme CSP is available in several configurations: electroplated, with ball heights less than 200 microns compatible with SMT; ball placement, with ball heights greater than 200 microns compatible with SMT and designed to avoid underfill; and single mask, an economical CSP available in limited design configurations. Unitive Advanced Semiconductor Packaging, Research Triangle Park, N.C.
Software Development Kit
Imaging Studio 5.0 is a complete C/C++ foundation library that serves as a high-level application program interface for machine vision application development. It provides support for frame grabbers and eliminates the need to develop algorithms for commonly used board control functions. Coreco Imaging Inc., Bedford, Mass.
TE-cooled PIN Photodiode Hybrids
Advanced Photonix Inc. has introduced a thermoelectrically (TE) cooled PIN photodiode hybrid assembly for high-precision, low-light detection applications. The compact hybrid consists of a large area (33.3 mm2), low leakage, silicon PIN photodiode and a low-noise, high-gain transimpedance preamplifier - all mounted on a single substrate and temperature controlled by a two-stage TE cooler. The deceives are well-suited for use in analytical instruments, portable devices, and industrial and military applications. Advanced Photonix Inc., Camarillo, Calif.
Universal Image Analysis Software
Phoenix/x-ray Systems has introduced the Image-Optimiser, a universal, fully integrated software program for real-time failure analysis and inspection. Ideally used for inspection and verification of boards using BGAs, flip chips, µBGAs and other high-density packages, the program can be used to determine process defects and design analysis for chip packaging and SMT manufacturers. Functions allow manipulation of images and data to define sizes (such as minimum ball size), tolerances, profiles, and solder ball voiding in automated or manual detection. Users can acquire an X-ray or video image of components or boards in real-time. Phoenix/x-ray Systems and Services Inc., Camarillo. Calif.
Pressure Analysis System
The Topaq Pressure Analysis System is a QC instrument available to packaging engineers to determine pressure distribution within a laminating press for multilayer PCBs and across the nip of rollers on dry film laminators. The analysis system is also useful to detect imperfections in resistor thickness within large-area substrates and uniformity problems during thermocompression in TAB processes and heat sink design. Features include histograms of pressure levels, enlargement and reduction capabilities, pseudo-color and three-dimensional viewing modes, and extensive smoothing, filtering and thresholding. Surface contact area to 3 mils can be analyzed. Sensor Products Inc., East Hanover, N.J.
LCD Driver Tester
Advantest Corp. has developed a new tester that enables fast and accurate testing of devices. The T6371 can simultaneously test a maximum of two thin film transistor device drivers or four chips that contain a controller and an LCD driver. Users can perform measurements of drivers with a maximum of 1,280 pins and the unit is capable of digital testing up to 125 MHz. The system also employs a per-pin comparator architecture, which enables users to perform high-speed function testing. Advantest, Tokyo, Japan.
Exitech has introduced the ELS-PE-300 laser pulse extender, a turnkey method that extends laser-pulse durations. It is optimized to accept input pulse in the 10 to 20 nanosecond range, and can optically stretch these without distortion or loss of coherence. The system is designed for both scientific and industry applications. Several standard models are available and are optimized for use with excimer, Nd:YAG, copper vapor or dye lasers. Customized versions are also available. Exitech, Menlo Park, Calif.
Self-profiling Oven Software Available
The KIC (San Diego) Pilot self-profiling oven software is now available on all BTU International reflow ovens that use BTU's Wincon 2.2 furnace control software. The software interfaces directly with the oven controller. It features a simplified animation-based user interface, so it does not require an experienced operator to profile the oven. BTU International, North Billerica, Mass.
New Thermally Conductive Polymer
CoolPoly, a thermally conductive polymer, conducts heat to generate a good isothermal profile. The polymer is intended to give design engineers a plastic material solution in applications where heat transfer requirements previously limited material selection to metals and ceramics. Applications include heating and cooling, computer, and portable electronics. Cool Polymers Inc., Warwick, R.I.
Signal Check Adapters
A full line of signal check adapters from Sunhayato Corp. are now available through Advanced Interconnections Corp. The adapters come with or without sockets for PC board signal testing. Terminals are provided on each adapter to access signals in three forms: thru-hole, straight pin and right angle. Most of the adapters are modular designs, so components can be added or changed to work with different device packages. Advanced Interconnections Corp., West Warwick, R.I.
Novec Eletronic Coating EGC-1700 protects PCBs from moisture, humidity and other liquid and solid contaminants. The product is a fluorochemical acrylate polymer solution used as a protective coating and surface modifier for PCBs, as a recording-head coating in the hard disk drive industry and as an anti-corrosion/anti-migration coating for electronic components and equipment. Features reportedly include ease of application, fast-drying attributes and a thinness that allows for easy repair and rework. EGC-1700 is said to add no mechanical cure stress on circuit components, and no subsequent coating pressure on parts during thermal cycling. 3M Performance Materials Division, St. Paul, Minn.
PowerPlug technology consists of solid, copper-plated via fills used in the fabrication of metalized ceramic substrates, chip carriers and packages. PowerPlug technology is said to promote thermal resistance as low as 2°C/W, expanding maximum operating temperature and power limits. Solid via plugs exhibit an electrical resistance as low as 0.38 milliohms. Remtec Inc., Norwood, Mass.
Advanced Package Designer Spider Route technology for complex, high-density interconnect IC packages provides algorithms for supporting all chip-attach technology. Spider Route is said to provide designers with any-angle, multi-layer routing capability, concurrent routing, pre-route feasibility and on-the-fly pin swap. Cadence Design Systems Inc., San Jose, Calif.
Thermal Management Software
The Flotherm Computations Fluid Dynamics software system allows design and packaging engineers to build and test computer simulations of the thermal performance of a proposed handheld electronic product quickly and accurately. The system can predict external airflow velocities, and can be used instead of building physical models. Flomerics, Southborough, Mass.
The IC-scan system tracks and controls moisture-sensitive devices during the SMT assembly process. The system uses RF tags that are temporarily attached to the trays and reels containing the electronic components. The system is modular and upgradeable. Cogiscan Inc., Bromont, Quebec, Canada.
Aqueous Cleaning System
The CBW-218 OmniJet aqueous cleaning system features all stainless-steel (polished) construction, sustained high solution heat capability, high-volume EDM spray bar with greater GPM concentration per square inch to clean densely configured boards, and a convection-type dryer with adjustable blow-off knives that produce high-velocity water strip action. Stoelting Inc., Kiel, Wis.
EPO-TEK EE165-3 is a silver-filled, electrically conductive adhesive designed for solder replacement in SMT, hybrid microelectronics and other electronic assembly applications. The product is said to provide the electrical and physical stability of a solder joint using an environmentally friendly process, and is recommended in applications where the temperature sensitivity of the components or substrates is critical to performance. Epoxy Technology, Billerica, Mass.
The ASL-2000 is an automatic magazine-to-magazine strip inspection system that is said to provide fast and reliable inspection of plastic packages prior to singulation. The system identifies delaminations and other internal discontinuities non-destructively, and reportedly provides high-throughput, low-cycle inspection that accommodates a minimum of 20,000 packages in a 21-hour day. The system allows for the configuration of a variety of different strips and can be applied to all plastic package designs. Sonix, Springfield, Va.
The most recent addition to Lambda's power systems family is the low-profile SC150 series of AC/DC switching power supplies. The series is said to provide a reliable source of power for computer peripherals, telecommunications, point-of-sale, test and measurement equipment in an industry-standard package that facilitates multiple sourcing. Lambda, an Invensys company, Melville, N.Y.
Chip Placement Machine
The KE-2030 chip placement machine offers flexibility and speed in a modular system. Features include a placement rate of up to 20,000 components per hour, two multi-nozzle laser heads with four nozzles, and bulk feeding capabilities. Three placement modes are possible: parallel, sequential and mixed. Juki Automation Systems, Morrisville, N.C.
Thick Film Surface Mount Resistor
Resistor manufacturer IRC has introduced a low-resistance, thick film surface mount resistor capable of handling power dissipation up to 3W. The LRF3W series of resistors employ a four-terminal design to achieve low-resistance values of 0.003 &Omeega; in tolerances to ± 1 percent and with a temperature coefficient of resistance of ± 100 ppm/°C. International Resistive Co. Inc., Corpus Christi, Texas.
K 30,000 Capacitors
The Maxi-Plus series of capacitors are said to be the first K 30,000 dielectric with X7R temperature characteristics. The series is designed to operate in the millimeter bands with an ultra-low equivalent series resistance specifically for the RF/microwave, optical and cellular markets. AVX Corp., a Kyocera Group company, Myrtle Beach, S.C.
Solder Recovery Systems
The EVS 2000/4000 solder recovery system takes dross that is normally disposed of and separates out the reusable solder from the actual dross contaminants. Reportedly, the recovered solder produced can be up to 80 percent of the amount of dross material put into the EVS. Technical Devices Co., Torrance, Calif.
The SP-Nano pump extends Creative Automation's proprietary Digital Dispensing process down to a pixel diameter of 0.006 inch. The pump is said to be capable of up to 90,000 shots per hour, and meets current dispensing requirements for conductive epoxies and lead-free solder in microwave, laser and fiber-optic applications. Creative Automation Co., Sun Valley, Calif.
The PCVisionPlus is a half-slot PCI bus frame grabber designed for high-speed inspection applications. The product is said to be capable of digitizing monochrome analog video at ultra high frequencies up to 53 MHz. The PCVisionPlus features 4 MB of on-board memory and hardware "scatter gather" that supports fully automated image transfers from image memory. Imaging Technology Inc., Bedford, Mass.
Variable Angle Viewing
Glenbrook Technologies now offers a variable angle viewing (VAV) option with their RTX series of real-time X-ray inspection systems. When equipped with VAV, Glenbrook systems reportedly provide 45-degree rotation of the X-ray source for oblique viewing of BGA components. All models in the RTX series feature cameras that are said to reveal defects as small as 0.001 inch with a full one-inch diameter field of view. Glenbrook Technologies Inc., Randolph, N.J.
The T-flex 600 series highly compressible gap filler is designed to alleviate tolerance problems that occur when multi-chip components are mated to a universal heat spreading device. This interface pad is said to conform well with minimal pressure, resulting in little or no stress on the mating parts. T-flex 600 has a thermal conductivity of 3 W/m°C and low thermal resistance. The product reportedly is compressible at 16 percent at 5 psi (for 40 mil material), is reusable and easy to rework. Thermagon Inc., Cleveland, Ohio.
Substrate Drying System
The AVID IPA drying system is designed for semiconductor and flat panel display substrates. The system is said to feature all the benefits of advanced Marangoni drying without the hazards and complexities of creating isopropyl alcohol (IPA) vapor. The delivery system atomizes IPA into microscopic liquid droplets, which create the differential surface tension drying without the need for IPA heaters or vapor safety equipment. L-Tech Corp., Mountain View, Calif.
Modular Parylene Coating System
An automated parylene deposition system has individual cells that allow for simultaneous coating of multiple products without intermixing. The PDS-2060 H-M/C Coater is designed to meet the specialized production requirements of small, unfixtured components. The fully automated vacuum deposition system incorporates individual removable cells for a total batch capacity of 2,796 in3. Specialty Coating System, Indianapolis, Ind.