August 2, 2012 -- Semiconductor packaging house Unisem (M) Berhad named Lee Hoong Leong as group COO, replacing Ang Chye Hock, who has retired. Ang will remain as executive director, responsible for sales and business development for the Group.
Lee assumes responsibility for the Group’s overall operations across Malaysia, the UK, China, Indonesia, and the US.
Lee joined Unisem after 10 years with UTAC, most recently as president of UTAC, Advanced Wafer Level Interconnects. His other positions with UTAC included concurrent president roles with UTAC Singapore and UTAC Shanghai. Prior to UTAC, Lee held management and executive positions at STATS Singapore, including VP of leadframe products, and served in various roles with Texas Instruments, Singapore and National Semiconductor, Singapore. Lee holds a bachelor’s degree in mechanical engineering from the University of Singapore.
Unisem is a global provider of semiconductor assembly and test services for many of the world’s most successful electronics companies. Unisem offers an integrated suite of packaging and test services such as wafer bumping, wafer probing, wafer grinding, a wide range of leadframe and substrate IC packaging, wafer level CSP and RF, analog, digital and mixed-signal test services. Our turnkey services include design, assembly, test, failure analysis, and electrical and thermal characterization. With approximately 10,000 employees worldwide, Unisem has factory locations in Malaysia; the UK; China; Indonesia; and the US. Visit its website at www.unisemgroup.com.