August 1, 2012 - PRNewswire -- FlipChip International (FCI), wafer-level packaging and flip chip bumping provider, named Weng Kay Lui as Asian sales director. Weng Kay Lui, based in Shanghai, will bring FCI’s services to the semiconductor industry in Asia.
FCI is installing expanded wafer-level chipscale packaging (WLCSP) capabilities at FlipChip Millennium (Shanghai), or FCMS. FCI recently acquired Millennium Microtech (Shanghai), or MMS, a provider of fully integrated semiconductor packaging and testing services. The acquisition provides “a platform for expansion of FCMS Asian independent world class WLCSP service in Shanghai,” said David McComb, SVP of sales and marketing, FCI.
Weng Kay Lui’s was formerly GM of SilTech Semiconductor Ltd, a wholly owned wafer bumping subsidiary of Semiconductor Manufacturing International Corporation (SMIC). Weng Kay Lui helped launch SilTech in 2008. He also has directorial experience with United Test & Assembly Center Ltd. in China and Korea. He holds a degree in computational finance from the National University of Singapore.
FCI provides wafer bumping and wafer level packaging products and services. FCI is a subsidiary of RoseStreet Labs LLC, a supplier of products and services for the semiconductor, renewable energy and life science markets. Learn more at www.flipchip.com.
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