July 30, 2012 -- Henkel Electronic Materials added LOCTITE ABLESTIK CDF 200P to its conductive die attach film offering. The pre-cut film is available in 150mm and 200mm diameter sizes for easy wafer-form matching. The film can be used as a dicing tape as well as die attach.
The pre-cut film joins LOCTITE ABLESTIK C100, a conductive die attach film in roll format.
Conductive die attach films enable uniform, consistent bondlines, eliminate die tilt, and work with thinned wafers, for leadframe and laminate packages. Films eliminate the fillet associated with paste-based die attach materials, which Henkel notes allows more die per package due to tighter die-to-pad clearance, and saves on wire bonding materials, substrate area, and mold compound usage.
LOCTITE ABLESTIK CDF 200P is compatible with commonly used lamination equipment, at lamination temperature of 65°C. The film is effective on die from 0.2mm2 to 5.0mm2; various wafer metallizations including bare silicon, TiNiAg and Au; and multiple leadframe metallizations such as Cu, Ag and Au. It is MSL-1-qualified with several package designs that include SO (SOT and SOD), QFN (DFN) and even smaller-die QFP devices. Henkel reports that the film has excellent electrical conductivity and very low RDSon shift of <10%.
Henkel operates brands and technologies in three business areas: Laundry & Home Care, Cosmetics/Toiletries and Adhesive Technologies. Henkel’s preferred shares are listed in the German stock index DAX. Learn more at www.henkel.com/electronics