Cascade Microtech modular wafer probe system offers 6 measurement packages

07/31/2012
Cascade Microtech's MPS150 wafer probe station.

July 31, 2012 - Marketwire -- Cascade Microtech, Inc. (NASDAQ:CSCD), wafer-level IC test equipment supplier, introduced the modular MPS150 manual probe station with six application-specific packages for high-accuracy RF, mmW, and I-V/C-V measurement; failure analysis; and high-power device characterization.

The probe station is designed to be upgraded as needed, with a scalable base platform and system packages.

Also read: Cascade Microtech touts wafer-level test innovators at inaugural Innovation Awards

The 6 pre-configured packages for specific measurement applications target measurement repeatability in a shared lab environment, such as a research lab or university. Multiple users can access the prober, change test set-up, and reset quickly to another set up.

The MPS150 system platform comprises a rigid microscope bridge and solid station frame, and a built-in vibration-isolation design. The design protects contact quality over measurement time. Probe placement and contact repeatability are served by backlash-free X-Y-Z movement of probe positioners, integrated platform planarization, and a contact separation drive with 1µm repeatability. All systems are designed for easy, ergonomic set up and operation.

Cascade Microtech's mmW package offers the shortest signal path to the device under test, resulting in the highest dynamic range and directivity, and is suited for probing up to THz frequencies.

The RF package incorporates proven methods for RF probing up to 67GHz, with the ability to probe pads as small as 25 x 35µm and beyond. Both RF and mmW packages come with WinCalXE on-wafer calibration software.

For I-V/C-V measurement, Cascade Microtech incorporates best-known methods in its coax solution for DC parametric test down to pA levels.

The triax package is dedicated to low-noise I-V/C-V measurements, enabling I-V measurements down to fA levels, and C-V investigations down to fF levels.

The power device characterization solution addresses precise, high-voltage probing of power MOSFET, IGBT, BJT and other power devices at breakdown voltages up to 3,000V (triaxial)/10,000V (coaxial), and high-current probing up to 100A with a dedicated triaxial chuck for low on-state resistance and leakage.

The failure analysis solution incorporates best-known methods for electrical failure verification, localization and debug, with the ability to probe features smaller than 1µm.

Cascade Microtech, Inc. (NASDAQ:CSCD) supplies tools for precision contact, electrical measurement and test of integrated circuits (ICs), optical devices and other small structures. For more information, visit www.cascademicrotech.com.

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