July 25, 2012 -- SEMI Europe will host a new event, the European 3D TSV Summit, January 22-23, 2013 in Grenoble, France. This inaugural meeting will revolve around the theme: "On the Road towards TSV Manufacturing," denoting how device designers and manufacturers are crossing from 2D packaging to 3D for more functionality in a smaller form factor.

Europe’s high-tech industry has responded to the need for more complex and higher functioning electronics with 3D IC integration, using through silicon vias (TSVs). Many European semiconductor companies are leaders in 3D IC; the event will support and showcase their capabilities.

IC device requirements continue to increase as applications get more complex and more SEMI calls TSV a "stepping stone" to get the most out of the combination of "More Moore" and "More than Moore."

According to Yole Développment, the shipment volume of 3D-IC wafers will reach 10 million units in 2012. Also read: 3D TSV packages outgrow semiconductor industry by 10X

The European 3D TSV Summit is expected to demonstrate the full range of 3D technology and R&D processes in Europe, with leading companies participating, showing a range from initial prototypes to high-volume production. The show is targeted at engineers up through top executives from European fabs, IDMs, TSV companies, equipment and materials companies and fabless, as well as international attendees who are interested in European capabilities.

In addition to the conference and an exhibition, attendees will get opportunities to network and participate in round table talks.

The European 3D TSV Summit steering committee includes: Wilfried Bair, VP of Strategic Business Development, SUSS Microtec; Eric Beyne, director of Advanced Packaging, IMEC; Kevin Crofton; EVP and COO, SPTS; Hannes Kostner, director of R&D, Datacon; Thorsten Matthias, director of Business Development, EV Group; Jean Michailos, R&D Technology program manager for 3D, STMicroelectronics; James Quinn, VP of Marketing and Sales, Multitest; Martin Schrems, director of R&D, austriamicrosystems; Nicolas Sillon, head of 3D Integration, CEA-Leti; and Juergen Wolf, department head of HDI WLP/ ASSID, Fraunhofer-IZM.
For more information about the event, please contact Yann Guillou in the SEMI Europe Grenoble Office, yguillou@semi.org, or visit www.semi.org

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