June 26, 2012 -- Solid State Technology is hosting a free webcast, 3D and 2.5D Integration: A Status Report, airing live tomorrow at noon EST/9AM PST. A fourth presenter has just been announced, Brent Przybus, Senior Director, Product Line Marketing, Xilinx Inc.
3D and 2.5D Integration: A Status Report will cover through-silicon via (TSV) formation, interposers, and other die stacking methods. What is the present status of these advanced packaging technologies?
Przybus will present “The Evolution of 3D ICs: Leaping Ahead of Moore’s Law to Deliver a 6.8B Transistor Device.” He joins David McCann of GLOBALFOUNDRIES, E. Jan Vardaman of TechSearch International and William Chen of ASE.
The webcast is sponsored by EV Group (EVG) and ALLVIA, and is free for all attendees.