June 29, 2012 -- Semiconductor assembly and test services (SATS) provider UNISEM (M) BERHAD (183314-V) relaunched its business model with the name “Unisem 2.0.” The company’s aims include lean manufacturing, a focus on the “right” Tier-1 customers, product and technology development in pursuit of high growth rates and margins, and more.
To achieve growth, the SATS provider will engage with strategic customers and focus resources on developing the “right products and technologies.” Unisem 2.0 is about focusing on attracting the right Tier-1 customers, retaining existing select customers, and concentrating on customers with high growth potential. Likewise, the packaging house will focus on developing products and technologies with high growth rates and margins.
In operations, Unisem is touting lean manufacturing and quality ownership, taking on new challenges and doing “old things in new ways,” according to a press release. This will improve process flows and reduce waste. Unisem noted early detection of defects in semiconductor packaging processes as key to this initiative. The goal is zero defects. Ownership refers to a “culture of accountability from employees to suppliers.” Unisem also will pursue continuous improvements. An MES/ERP system will offer real-time performance data and enable more agile reactions to trends.
Organizationally, Unisem will embrace a culture of “learning and empowerment.” The company is implementing an e-Learning Management System (LMS) and promoting internal and external benchmarking of best practices.
Unisem is a global semiconductor assembly and test services (SATS) provider offering wafer bumping, wafer probing, wafer grinding, a wide range of leadframe and substrate IC packaging, wafer-level CSP and RF, analog, digital and mixed-signal test services and turnkey services. See www.unisemgroup.com.