June 29, 2012 - BUSINESS WIRE -- Semiconductor fab tool supplier Ultratech Inc. (Nasdaq:UTEK) acquired the rights to a collection of patents from semiconductor leader IBM. Ultratech gained semiconductor packaging technologies including C4 bumping, ball grid array (BGA) methods, lead-free solders, and 3D packaging IP.
Representing both U.S. and foreign patents, the portfolio includes claims directed at methods of making, at compositions and at structures of semiconductor devices. This acquisition strengthens and broadens Ultratech's offerings to facilitate advanced packaging at the lower device nodes.
Ultratech, Inc. (Nasdaq: UTEK) designs, manufactures and markets photolithography and laser processing equipment. Visit Ultratech online at: www.ultratech.com.
IBM makes semiconductors and other microelectronics. For more information on IBM, please visit:www.ibm.com
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