June 13, 2012 -- StratEdge Corporation, high-performance semiconductor package maker for microwave, millimeter-wave, and high-speed digital devices, launched the LL family of high-power laminate packages. The LL leaded laminate copper-moly-copper (CMC) base packages dissipates heat from high-power compound semiconductor devices, such as gallium nitride (GaN), gallium arsenide (GaAs), and silicon carbide (SiC) chips.
These packages handle applications through 6GHz, suiting use in RF radios for communications, radar, and high-power millimeter-wave signals.
The series includes two laminate power packages, both with a ratio of 1:3:1 CMC, a good thermal match for alumina-based materials and a GaN chip. StratEdge offers both flange and flangeless styles to accommodate manufacturing processes to either bolt down or solder the package. The LL802302 is 20.32 x 9.91mm with 2 leads and a raised lid with an epoxy seal. This is a flange package with a bolt hole on each end so the package can be bolted to the printed circuit board (PCB). The LL362302 is a flangeless, fully hermetic version of the LL802302 package, with a flat ceramic lid. Hermeticity is especially critical in aerospace and defense applications.
"StratEdge's new laminate power packages solve thermal problems encountered when using GaN devices," explained Tim Going, StratEdge president. "The excellent thermal conductivity of the CMC base enables use of GaN devices in high power applications, and the flange package facilitates manufacturing."
IMS2012 is taking place in The Palais de Congres, Montreal, Canada, June 19-21, 2012. StratEdge will debut the new package family at booth #1625.
StratEdge Corporation designs, manufactures, and provides test and assembly services for a complete line of high-performance semiconductor packages operating from DC to 50+ GHz for the high speed digital, mixed signal, broadband wireless, satellite, point-to-point/multipoint, VSAT, and test and measurement industries, as well as aerospace stripline filters. Website: www.stratedge.com.