June 19, 2012 - BUSINESS WIRE -- Signetics Corporation approved plans to purchase additional semiconductor assembly process equipment -- wafer grinders, wafer saws, die attach tools, and wire bonders -- to grow its packaging capacity for mobile chips.
The capital expenditures (capex) are phase 4 of Signetics’ 2012 growth plan. Adding tools to support assembly of mobile consumer chips will enable the company to grow its market share in this sector. Mobile consumer electronics are a high-growth segment that requires quality and service support, said J.I. Kim, CEO of Signetics.
The funds will go to additional wafer grinders from Disco, which can perform gettering dry polishing (GDP).
Signetics has spec’d new wafer saws from Disco and TSK, citing capabilities, quality and efficiency.
At die attach, new Shinkawa and Esec die attach equipment will be added.
Iconn wire bonders from Kulicke & Soffa will expand Signetics’ capacity for palladium-coated copper (CuPd) wire bonding. These tools will support larger 95mm-width printed circuit board (PCB) substrates.
Signetics, a member of the Young Poong Group, offers semiconductor assembly and test in Korea. Signetics has been certified to the major quality standards including ISO/TS16949, ISO14001, Sony Green Partner and Samsung Eco Partner. Learn more at http://www.signetics.com/en/.