June 22, 2012 -- SEMICON West is taking place July 10-12 at the Moscone Center in San Francisco, CA. Following are new products for semiconductor packaging and test that will be at the show, from wafer bonders to LED die attach materials.
Automated temporary bonding/debonding system
The EVG850 TB/DB XT Frame from EV Group is an automated temporary bonding and debonding system for thin wafer handling, configured to address high-volume 3D IC and TSV manufacturing. The system temporarily bonds a device wafer to a rigid carrier wafer for safe and efficient processing of the device wafer. After subsequent processing (back thinning, lithography, metallization, etching, through via processing, etc.), the device wafer is debonded from the carrier substrate using various techniques dependent of the intermediate material. The system can be configured for LowTemp debonding methods like ZoneBOND technology with the required EZR (Edge Zone Release) and EZD (Edge Zone Debond) modules. A thermal-activated, mechanical slide-off is utilized for thermo-plast materials, while UV-exposure and lift-off debond is utilized for UV-activated tapes. It accommodates up to 9 process modules and boasts a continuous-mode operation with an ultra-fast handling system, up to 4 FOUP load ports, a material buffer in the form of a local FOUP storage system holding up to 10 additional FOUPs, and in-line metrology module option. EV Group, South Hall, Booth 719.
Electrochemical deposition tool
TEL NEXX's new plating tool, Stratus Thunder, is used for electrochemical deposition of TSV, middle and interposer, lead-free, copper pillar, and RDL advanced packaging materials. Stratus Thunder features a low-cost vertical plating architecture and additional features improve its productivity by up to 50%. TEL, South Hall, Booth 1531.
The MAX-800 is a large format, high speed X-Y-Z spray coating system designed for the thin, uniform application of a variety of coatings and suspensions used in semiconductor packaging, display manufacturing, fuel cell manufacturing and medical device manufacturing applications. The system features USI’s proprietary nozzle-less ultrasonic spray head technology for a thinner, more uniform and repeatable coating application compared to conventional spray techniques. Options for the system include application-specific sized heated substrate fixture with vacuum hold, a heavy-duty conveyor for large substrates and pallets, an automated reel to reel system for coating foil substrates and a walking beam conveyor for transporting tablet computer sized glass plates. The optional active HEPA filtration system and vacuum purged actuators ensure class 100 clean room compatible conditions in the spray area. USI’s Precision Metering Pump liquid delivery system with servo motor control and automatic pump re-fill, delivers precise, repeatable liquid flow to the spray head. Ultrasonic Systems Inc. (USI), North Hall, Booth 6264.
Packaging materials for LEDs, power semiconductors
ALPHA Argomax Silver sinter pastes and films suit power semiconductor die attach applications. Argomax was engineered to perform in fast-sintering, high-volume manufacturing to form lead-free metallic silver bonds. Alpha’s Die Transfer Film process is a combination of ALPHA Argomax 8020 film and Datacon equipment capabilities. Alpha’s Lumet line of lead-free solder paste covers a broad range of LED applications. Atrox conductive adhesive suits die attach applications. The company also makes solder spheres and fluxes for CSP and WLP. Alpha will introduce ultra-high precision stencils developed for semiconductor manufacturing applications. Alpha, a business unit of Cookson Electronics, South Hall, Booth 2341.
Direct chip attach process for LEDs
Palomar Technologies Assembly Services has developed a new precision eutectic process for direct chip attach (DCA) of LEDs. The DCA process eliminates the need for wire bonding and improves both electrical and thermal performance, similar to conventional flip chip bonding. All attachment sites first receive a dot of flux from an automated dispenser onto each terminal (anode and cathode). A Palomar Technologies 3800 Die Bonder places the LEDs with ≤5µm placement accuracy at 3-sigma. All LEDs are independently reflowed through the Palomar Technologies Pulsed Heat System (PHS) according to package specs. The PHS tool enables both pick-and-place and reflow of the die without affecting the position or attach integrity of a previously placed die. Assembly Services can even support such packages as 390 700µm LEDs that are attached with an Au/Sn solder to a single 50mm metal core carrier. The process is supported by equipment certification, product inspection and SPC data collection methods. Assembly Services has been utilizing direct-attach LED packaging for major international LED manufacturers in the division’s Class 1,000-10,000 clean rooms in Carlsbad, CA. Palomar Technologies, North Hall, Booth 6157.
Panasonic will show attendees examples of materials, processes, and manufacturing execution system (MES) software for microelectronics manufacturing. Panasonic’s evolving materials will include a collection of NS-LTCC (Non-Shrink Low Temperature Co-fired Ceramic) and ALIVH (Any Layer Inner Via Hole) substrates enabling fine patterns, high density routing and thinner packaging. Featured process solutions will include the MD-P200, for high-productivity bonding, and plasma solutions for singulation and cleaning. Panasonic Factory Solutions Company of America, Booth 6471.
Watch the Solid State Technology website for many more product previews of SEMICON West, including a preview of wafer fab tools and handling accessories, lithography products, metrology tools, and more.