June 12, 2012 - PRNewswire -- Terepac Corp. will produce high volumes of its proprietary micro circuits for Rockwell Automation, supporting the "Internet of Things" with radio frequency identification (RFID) tags. Rockwell Automation will support the infrastructure that Terepac uses, enabling it to miniaturize significantly more circuits than its current capability.
Terepac’s semiconductor packaging and assembly method creates sophisticated microelectronics printed on flexible substrates at the nanoscale. The circuits are a fraction of the size and cost of those fabricated with conventional methods. Entire structures with microprocessors, memory and sensors can be reduced to less than a millimeter square, thinner than paper, and flexible enough to bend around a pencil, maintaining performance.
Terepac recently announced the TereTag, an embedded electronic device that supports identification, communication, and more, allowing virtually any object to become part of the "Internet of Things." Ambient connectivity and monitoring can be applied in health, energy, industrial and other processes.
Terepac Corporation is enabling the Internet of Things with new semiconductor assembly technologies. For more information, please visit www.terepac.com.
Rockwell Automation Inc. is dedicated to industrial automation and information.