June 25, 2012 -- Solid State Technology will present 3D and 2.5D Integration: A Status Report on June 27, free for all attendees. William Chen, ASE, will join speakers David McCann, GLOBALFOUNDRIES and E. Jan Vardaman, TechSearch International. The webcast is sponsored by EV Group (EVG) and ALLVIA.
3D and 2.5D Integration: A Status Report will cover through-silicon via (TSV) formation, interposers, and other die stacking methods. What is the present status of these advanced packaging technologies?
Now, William Chen, senior technical advisor, Advanced Semiconductor Engineering Inc. (ASE US Inc.), had been added to the speaker list for this webcast. ASE is a leading semiconductor assembly and test services (SATS) provider, headquartered in Taiwan. William Chen recently spoke at The ConFab 2012, where he discussed the rise of “ambient electronics” and the Internet of Things, as well as the ecosystem necessary for 3D packaging.
You can learn more about the 3D and 2.5D Integration: A Status Report webcast here, or take a sneak peek at David McCann’s presentation here.
Register to attend the webcast, June 27 at 9AM PST/noon EST or on-demand, at http://video.webcasts.com/events/pmny001/viewer/index.jsp?eventid=43122
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