June 20, 2012 -- DELO introduced the DELOMONOPOX AD268 epoxy resin to meet the low-cost, reliable-attach needs of radio frequency identification (RFID) device makers. The anisotropic, electrically conductive adhesive provides fast cure at chip attach, and is designed for flip-chip RFID packaging, as well as other packaging applications.
DELOMONOPOX AC268 reliably bonds chips, which measure down to 400µm, to defined positions on the RFID antenna. It cures in 6 seconds at 190°C with a thermode and adheres to PET, polyimide, FR4, copper, aluminum and silver substrates. Up to 20,000 microchips can be bonded per hour on a flip-chip production system.
Also read: DELO die attach adhesive suits temperature-sensitive electronics
DELOMONOPOX AC268 was tested in DELO’s engineering labs, including temperature shock tests, bending tests and storage in a climatic chamber. DELO tested the product at 85°C/85% relative humidity (RH). The adhesive’s resistance to humidity suits outdoor applications, as well as high-quality product tagging.
DELO manufactures industrial adhesives. Further details can be found at www.delo.de/RFID.
Print
Email
Save
