June 6, 2012 -- Ron Huemoeller of Amkor presented in the Advanced Packaging session of Solid State Technology’s The ConFab. He speaks with editor-in-chief Pete Singer. The ConFab is Solid State Technology’s invitation-only meeting of the semiconductor industry, taking place this week in Las Vegas.
“3D and 2.5D integration are very fluid right now. Development is very very active and accelerating,” Huemoeller said, noted that the products are “reality” now. Amkor has a low-volume, highly complex 3D product launching to production now, and sees firm commitments to roadmaps this year and in the near future. Low-voltage, low-wattage 3D chipscale packages (CSP) are debuting first because they do not have the thermal limitations of high-voltage products. Higher volumes will come in 2-3 years, he predicts.
On interposers, or 2.5D packaging, Huemoeller says that glass and advanced laminate interposers will meet niche packaging needs, but silicon interposers will be a widespread technology. Once qualified in, interposers will be around for a long time, and offer significant benefits to the electronics device.
Dig deeper into 3D and 2.5D packaging technologies with our report on The ConFab session, “Advanced Packaging and Progress in 3D Integration.”
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