May 4, 2012 -- Semiconductor packaging and test services provider Carsem will assemble and further develop light-emitting diode (LED) packaging technologies, partnering with a key customer.
Carsem has begun assembling and qualifying high-brightness silicon-substrate LED arrays and will ramp high-volume, full turn-key manufacturing services, including electrical testing, laser mark, and tape-and-reel, in early 2012.
To enable standard mass production, Carsem deployed matrix substrate design; auto die attach, wire bond, and high reflection coating dispense; compression molding through an automold system; substrate-mapping; and bin sort per test mapping on the LED packages.
Carsem’s experience in turnkey semiconductor packaging enabled its LED customers to bring products to market faster, based on high-density, high-volume packaging technology, said Albert Law, Carsem VP of worldwide sales and marketing. Knowledge derived from semiconductor materials, processes, and equipment enhanced the “manufacturability and efficiency” of the customer’s HB-LEDs, added L.W. Yong, Carsem CTO.
Also read: LED cost reduction to come from manufacturing
Carsem provides turnkey packaging and test services to the semiconductor industry. Website: www.carsem.com.