May 18, 2012 - BUSINESS WIRE -- In 2012, the global IC substrate market will reach a value of USD8.67 billion, according to Research in China’s “Global and Chinese IC Substrate Industry Report, 2011-2012.” As IC operating frequencies improve and integration increases, traditional leadframe packaging is giving way to substrate-based semiconductor packaging, such as ball grid array (BGA), chipscale packages (CSP) and flip chips (FC), of which the latter two now prevail.
IC substrate vendors are principally printed circuit board (PCB) manufacturers, selling IC substrates to IC packaging companies, which also exert the most influence on substrate suppliers. Also read:Top OSATS raise 2012 capex with semiconductor test focus
CPUs and GPUs use FC-BGA packaging, featuring large packaging area, many layers, and high unit price. FC-CSP packages are designed into smartphones, PCs, and other products. Most of the ICs in mobile phones (such as Bluetooth / WiFi / FM, CMOS image sensor, USB controller, GPS, touch screen controllers, audio codec, MOSFET, DC/DC converter, etc) adopt wafer-level chipscale packaging (WLCSP).
Taiwan’s IC packaging and testing industry holds majority (56%) market share globally. Three out of the global top four packaging and testing corporations are from Taiwan (Advanced Semiconductor Engineering Incorporated and Siliconware Precision Industries Co. Ltd included). Chinese Mainland performs just 3% of IC packaging and testing. Taiwan’s semiconductor packaging & test services (SATS) providers support its world-leading wafer foundries; 60% of the 50nm and smaller node IC business is undertaken by TSMC, with nearly 100% market share in ICs made for smartphones fabricated by TSMC and UMC, Research in China reports. In the global IC substrate packaging market, Taiwanese players sweep more than 70% share.
Japanese manufacturers occupy the market of CPU, GPU and Northbridge IC substrate for PC. In 2012, NGK shuttered, and its market share was taken by Taiwan's Nanya PCB. Also, Japanese companies reign in the high-end market, they develop the FC-BGA technology with Intel and their positions remain quite stable. IBIDEN is building a base in the Philippines to lower prices. IBIDEN and Shinko focus on Ajinomoto Build-up Film (ABF) substrates, both of which take no interest in bismaleimide triazine (BT) substrates in the field of communications.
SEMCO is a leading South Korean manufacturer, with large orders from Qualcomm and Samsung Electronics and a small portion of orders from Intel or AMD. SIMMTECH, also a leading memory PCB maker, is mainly engaged in the memory substrate packaging. Memory PCBs will apply substrate packaging widely, in particular all of MCP memory PCBs may utilize substrate packaging in 2013.
Among Taiwanese manufacturers, Nanya PCB has Intel as its major client, while Kinsus is a PCB supplier for Qualcomm and Broadcom, 90% shipment of which goes to BT substrate.
Research and Markets added "Global and Chinese IC Substrate Industry Report, 2011-2012" report to their offering.
IC substrate manufacturers in the report include Unimicron, IBIDEN, Dae Duck Electronics, SIMMTECH, LG INNOTEK, SEMCO, NANYA PCB, Kinsus, and Shinko.
Packaging companies covered include Advanced Semiconductor Engineering Incorporated (ASE), Amkor, Siliconware Precision Industries Co. Ltd. (SPIL), and STATS ChipPAC.
For more information, visit http://www.researchandmarkets.com/research/mv8nq8/global_and_chinese
Print
Email
Save
