May 21, 2012 -- Bhavesh Muni took the helm as global business director for the Advanced Packaging Technologies (APT) business of Dow Electronic Materials. Muni will drive growth for Dow’s semiconductor packaging materials product portfolio and the company’s manufacturing capabilities.
Muni was previously APT’s global marketing director. Before joining Dow Electronic Materials in 2010, he held several positions in global business development, product development, and sales & marketing with Henkel Electronic Materials, Lord Corp., Emersion & Cuming, and Olin Hunt Conductive Materials. He brings more than 23 years of experience in commercializing materials for electronics assembly and semiconductor packaging to the role.
Muni holds an M.S. degree in Polymer Science from the University of Detroit, MI and a B.E. in Chemical Engineering from Regional Engineering College in Srinagar, India.
Dow (NYSE: DOW) is a wide-ranging science and technology company offering specialty chemicals, advanced materials, agrosciences and plastics for electronics, water, energy, coatings and agriculture. Dow Electronic Materials is a global supplier of materials and technologies to the electronics industry, serving the semiconductor, interconnect, finishing, photovoltaic, display, LED and optics markets. Dow Electronic Materials has manufacturing and research facilities in the US, Europe, China, Taiwan, Japan and Korea.
More information about Dow can be found at http://www.dow.com.