May 16, 2012 -- The ASM iHawk Xpress Opto Wire Bonder from backend semiconductor assembly equipment supplier ASM Pacific Technology offers new innovations in transport, copper-wire bonding, and automatic rethreading.
The new wire bonder handles leadframes up to 100mm-wide on its improved transport. The larger leadframe-acceptance specification is designed to reduce transport times.
The bonder’s accuracy was improved to 3µm, and ASM's GoCU technology enables it to operate faster with lower-cost copper wire rather than with gold wire, maintaining accuracy.
The Auto Wire Rethread System of the ASM iHawk Xpress ensures that the bonding wire is clamped in place and automatically rethreaded after a break. If the wire breaks in the wire clamp at the bonding head, it is held in place by a second clamp just behind the bonding head and automatically rethreaded.
Also new is the software in the ASM iHawk Xpress. Fully based on Microsoft Windows for more investment protection and featuring an improved pattern recognition system (PRS), it detects patterns and positions quickly and reliably for a fast start of the bonding process.
The wire bonder targets European component manufacturers operating flexible packaging operations requiring high precision, such as development, prototyping, and small-lot production. ASMPT recently integrated its European operations with its SIPLACE business unit there.