May 23, 2012 - GLOBE NEWSWIRE -- Applied Nanotech Holdings Inc. (OTCBB:APNT) uncrated the THERCOBOND family of highly thermally conductive bonding and printed materials for power electronics and photonics packaging. The first 2 products are polymer-based (DTC-P) and ceramic-based (DTC-C).
THERCOBOND materials are designed for power electronic device packaging and dielectric coating, balancing thermal conductivity, thermal diffusivity, thermal expansion, dielectric and insulating properties, wettability, and printability. The thermal interface composites boast a “significantly higher level of heat dissipation performance” to meet the requirements of the power sector, said Dr. Nan (David) Jiang, director of the Thermal Management Division at Applied Nanotech, Inc.
THERCOBOND materials are applied via conventional screen printing, drawdown, and inkjet and other printing approaches. They form thermally conductive dielectric layers on various semiconductor packaging and electronics assembly substrates.
DTC-P thermally conductive, electrically insulating materials are based on dielectric polymers modified to maximize thermal conductivity with excellent adhesion and wettability to metals, semiconductors, and graphitic substrates (e.g. APNT’s CarbAl). DTC-P is one-part bonding material and has a working temperature up to 300°C.
DTC- thermally conductive, electrically insulating materials are based on dielectric ceramics, similarly modified. DTC-C is one-part bonding material with a low CTE (< 7 ppm/K after curing), and highly heat resistive with a working temperature up to 400°C.
Applied Nanotech Holdings Inc. is a global nanotechnology company that sells products and license patents and technology to partners that will manufacture and distribute products using the technology. Applied Nanotech's website is http://www.appliednanotech.net .