April 24, 2012 - Marketwire -- NXP Semiconductors N.V. (NASDAQ:NXPI) released the new SOT1226 "Diamond" package using a “unique pad pitch design” to create the smallest-possible logic package. It is 25% smaller than NXP’s SOT1115, measuring 0.8 x 0.8 x 0.35mm in a leadless plastic form factor with 5 leads. It offers general-purpose low-voltage CMOS (LVC) and advanced ultra-low power (AUP) CMOS logic functions.
The pad design offers a 0.5mm pad pitch, 50% larger than typical small package designs, enabling board-level assembly with the miniaturized logic package. Typical package designs use a 0.3mm or 0.35mm pad pitch, which require step-down solder masks at board-level assembly. The larger pad pitch of the Diamond package offers greater contact area for less exacting component placement, improved solder joint strength and robustness, and reduced risk of short circuits.
The design targets leading-edge portable devices such as smartphones. Chip makers can design within smaller geometries without increasing manufacturing costs, and standardize their entire product portfolio, said Kristopher Keuser, director of marketing, Logic business line, NXP Semiconductors.
NXP Semiconductors N.V. (NASDAQ:NXPI) provides high-performance mixed-signal and standard product solutions around RF, analog, power management, interface, security and digital processing. Additional information can be found by visiting www.nxp.com.