April 26, 2012 -- At its Fab 8 in Saratoga County, NY, GLOBALFOUNDRIES is installing a special set of semiconductor production tools to create through-silicon vias (TSV) in 20nm node semiconductor wafers. 3D die stacking of leading-edge chips will enable mobile and consumer electronics. The first full-flow silicon with TSVs is expected to start running at Fab 8 in Q3 2012.
GLOBALFOUNDRIES is working with partners to develop packaging processes on advanced silicon nodes, said Gregg Bartlett, CTO, GLOBALFOUNDRIES, noting the complexity of chip/package interactions in next-generation nodes and the scaling alternative offered by 3D integration. The 20nm TSV capabilities at Fab 8 are supplemented by GLOBALFOUNDRIES’ joint development and manufacturing partnerships with companies across the semiconductor ecosystem, from design to assembly and test, Bartlett said.
GLOBALFOUNDRIES’ aim is to offer foundry customers “maximum choice and flexibility,” with an eye to cost savings, time-to-volume, and reduced technical risk with new technologies, he added.
GLOBALFOUNDRIES’ Fab 8 campus is focused on leading-edge semiconductor manufacturing at 32/28nm and below, with 20nm technology development underway.
GLOBALFOUNDRIES is a full-service semiconductor foundry with operations in Singapore, Germany and the US. The company’s three 300mm fabs and five 200mm fabs provide the full range of process technologies from mainstream to the leading edge. GLOBALFOUNDRIES is owned by the Advanced Technology Investment Company (ATIC). For more information, visit http://www.globalfoundries.com.
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