April 11, 2012 -- Georgia Institute of Technology (Georgia Tech) Packaging Research Center (GT-PRC) proposes a new consortium on 3D semiconductor packaging called 3D ThinPack (THInPack) for ultra-miniaturized 3D heterogeneous, RF, digital and power modules in partnership with global companies.

The goal is ultra-miniaturized heterogeneous sub-systems created using 3D integration of multiple ultra-slim packages with embedded thin active or passive components. Within 2 years, the consortium will demonstrate a 4-package stack within ~1mm thickness.

GT-PRC has been developing ultra-miniaturized embedded MEMS, actives, and passives (EMAP) technology through a global industry consortium of about 15 semiconductor, package and supply-chain companies with chip-last (CL) interconnections but with chip-first benefits to demonstrate ultra-miniaturized modules with digital, RF, analog, MEMS and sensor functions. GT-PRC has demonstrated ultra-thin organic substrates, fine-pitch copper-to-copper (Cu-Cu) interconnections, low-temperature bonding with high assembly throughput and prototype functional module demonstration of digital Si and RF GaAs die embedding.

Building on these advances, GT-PRC’s next consortium on 3D ThinPack will address 3D package stacking beyond conventional PoP, leading to ultra-thin stacked modules; ultra-fine pitch and low profile package-to-package interconnections; novel thermal solutions for embedded thin die eliminating thermal interface materials (TIM); 15µm pitch die-to-package Cu-Cu I/Os with high current carrying capability; ultra-slim substrates with low warpage; and embedded thin integrated passive devices (IPDs).

Figure. Proposed technologies for ultra-miniaturized 3D stacked modules.

The proposed 3D ThinPack research addresses the need for highly miniaturized and functional heterogeneous modules with particular focus on high-yield, low-cost, chip-last embedding with FR4-compatible manufacturing-processes; and interconnections and assembly processes compatible with existing infrastructure.

Companies interested in this new consortium can contact Nitesh Kumbhat at nitesh.kumbhat@prc.gatech.edu, 404 385-0730 or Professor Rao Tummala at rao.tummala@prc.gatech.edu, 404 894-9097.

Learn more about the 3D Systems Packaging Research Center at Georgia Institute of Technology via www.prc.gatech.edu. Also read: Georgia Tech increases interposer development work

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