April 12, 2012 -- Adhesives maker DELO introduced DELOMONOPOX die attach adhesives, promising strong mechanical/environmental protection, low-temperature cure, and compatibility with various chip packaging substrates.
The DELOMONOPOX adhesive family for die attach adhere to all smart card substrates including silicon, epoxy and gold, as well as new substrates, such as PEI, PET and PEN. DELOMONOPOX adhesives cure in seconds at low temperatures.
When used for bonding and encapsulating chips in smart card modules, the adhesives mechanically safeguard the chips and the contacting area from pressure, bending and torsion. They also protect the die from physical influences and environmental conditions such as humidity, cold or heat.
DELO’s die attach adhesives are built on the same chemical basis as its chip encapsulants for dam and fill.
DELOMONOPOX products are available as unfilled non-conductive products, or filled for grounding or conductive products.
DELO is a leading manufacturer of industrial adhesives. Web: www.DELO.us.
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