Burn-in and test system offers device-by-device temperature control

MCC burn-in and test system.

April 16, 2012 -- Micro Control Company uncrated the HPB-5C High-Power Burn-In System, with variable airflow control for active thermal control of each device under test. The HPB-5C provides individual temperature control to each device under test. The tool can burn-in and test up to 150W devices.

Test tool operators can adjust the speed of the oven blower during system operation on a device by device basis as required. Active thermal control provides precise temperature control, up to 150°C, for each device under test while supporting a range of burn-in and test strategies. For applications that do not require individual temperature control of the devices, many more devices can be burned in with test during a burn-in cycle. It also supports embedded temperature sensor control.

The HPB-5C also has an increased vector memory depth over previous Micro Control burn-in systems, the company reports, with 32M vector memory standard and 64M optional. Large numbers of test vectors can be run without waiting on reloads.

The system runs up to 16 burn-in boards with up to 24 devices per board (up to 384 devices total). That equals up to 128 I/O signals per board plus 24 chip select drivers. Each burn-in board has a voltage regulator output programmable up to 1080 Amps.

Programmable logic controller (PLC) oven control and dual VIH rails are now standard. The system uses programmable clocks with leading & trailing edges per pin, 2-ns resolution, and 8 on-the-fly timing sets. High-speed clock range is 1.5625 to 800 megahertz, with vector formats up to 1 of 12 per pin per cycle.  

Micro Control Company manufactures automatic test equipment and burn-in/environmental systems. Internet: www.microcontrol.com

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