March 6, 2012 -- Henkel developed LOCTITE UF3810 underfill for high reliability and ease of rework when applied to next-generation wafer-level chipscale packages (WLCSP) and package-on-package (PoP) devices.
LOCTITE UF3810 is formulated to be halogen-free, reworkable, and demonstrate a glass transition temperature (Tg) of 100°C for robust thermal cycling reliability. The material flows fast and underfills at room temperature, curing quickly at 130°C. It is proven solder-compatible.
The underfill offers drop and shock protection, suiting packages used in mobile electronics, and improved thermal cycling reliability for fine-pitch (0.5mm-pitch and below) area-array devices. In addition to the handheld market, LOCTITE UF3810 is being qualified in the defense/aerospace and automotive sectors for high-reliability CSP and PoP designs.
Henkel operates worldwide with brands and technologies in three business areas: Laundry & Home Care, Cosmetics/Toiletries and Adhesive Technologies. For more information on LOCTITE UF3810 or any of Henkel’s next-generation underfills, log on to www.henkel.com/electronics.
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