February 3, 2012 - Marketwire -- Silicon Frontline Technology Inc. (SFT), an EDA company in the post-layout verification market, announced that X-FAB Silicon Foundries, a More-than-Moore semiconductor foundry, has used SFT's R3D (Resistive 3D) software for X-FAB's 0.18µm high-voltage process (XH018), providing improvements in reliability and efficiency.

X-FAB's XH018 modular mixed-signal CMOS technology can be integrated with high-voltage (HV) and non-volatile memory (NVM) modules, making it ideal for system on chip (SOC) applications in the automotive market and embedded NVM applications in the communications, consumer and industrial markets.

Also read: X-Fab touts embedded NVM for single-chip designs

R3D is used for extraction and analysis of power devices. The combination of SFT's R3D software and X-FAB's 0.18 micrometer process supports advanced electronic designs targeting mixed-signal applications with HV and NVM modules.

"Our customers are seeking ways to design more reliable and efficient SOCs for their automotive, power management and NVM embedded applications," stated Thomas Ramsch, Director Design Support at X-FAB. "After extensive evaluations, we decided to start using Silicon Frontline's R3D software for our XH018 process. R3D enhances our customers' SOC design quality and time to market with its powerful analysis and visualization of current density, potential distribution and IR drop. Therefore, we will offer XH018 Pcells for driver integration as part of our PDK by early March, giving customers a way to check their layout, optimize Rdson and do reliability checks."

X-FAB manufactures wafers for automotive, industrial, consumer, medical, and other applications on modular CMOS and BiCMOS processes in geometries ranging from 1.0 to 0.13 micrometers, and offers special BCD, SOI and MEMS long-lifetime processes. It is recognized for solid, specialized expertise in advanced analog and mixed-signal process technologies, and maintains a high level of responsiveness, service and technical support for its customers.

Silicon Frontline's R3D combines 3D extraction with a new analysis engine to handle the accuracy and capacity requirements with a fast turnaround. To date, R3D has been adopted by more than 20 customers and applied to MOS, DMOS, LDMOS, vertical DMOS, waffle-style and GaN HEMT designs.

F3D (Fast 3D) is used for fast 3D extraction and R3D (Resistive 3D) is used for 3D extraction and analysis of large resistive structures. F3D is chosen for its nanometer and Analog Mixed Signal (A/MS) design verification accuracy, and R3D for analysis that leads to improvements in the reliability and efficiency of semiconductor power devices. H3D is the industry's first commercial hierarchical 3D extractor for post-layout verification. H3D offers hierarchical parasitic extraction, hierarchical netlisting, unlimited capacity and field-solver accuracy.

SFT's products work with design flows from the leading EDA suppliers. The company's customers are in North America, Japan, Asia and Europe. Target markets include memory, Analog Mixed Signal (A/MS), image sensors, power devices and high-speed nanometer designs.

Silicon Frontline Technology, Inc. provides post-layout verification software. For more information, please visit www.siliconfrontline.com.

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