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February 15, 2012 -- Finetech will donate a high-accuracy die bonder in a drawing this summer that is open to U.S. and Canadian qualified universities and colleges.
The multi-application FINEPLACER Pico MA bonder with 5µm placement accuracy is being given away to celebrate Finetech's 20th year in business.
Finetech's die bonders are installed for university R&D that requires precision and repeatability in a platform that adapts to diverse applications.
The FINEPLACER Pico MA is an “all-in-one” modular platform for advanced packaging and assembly applications: flip chip, optoelectronics, 3-D, wafer-level integration, micro-optics assembly, sensor packaging and precise die bonding.
For more information or to register for the drawing, visit http://www.finetechusa.com/bonders/products/promotion.html.
Finetech manufactures manual and fully automatic component rework and high-precision bonding and die attach equipment.
