Synova Laser MicroJet wafer dicing tools to be made by Makino

Makino-built laser wafer dicing tool based on Synova water-guided laser technology.

February 9, 2012 - BUSINESS WIRE -- Synova SA formed an OEM agreement with its partner Makino Milling Machine Co. Ltd., wherein Makino will manufacture Laser MicroJet (LMJ) tools based on Synova technology.

Laser MicroJet systems virtually eliminate heat in applications such as semiconductor wafer dicing, via drilling, etc. The LMJ’s water-guided laser beam cuts/drills parallel and clean kerfs or holes.

Also read: Water-jet-guided Laser Technology by Synova

The new manufacturing cooperation combines process application expertise from Synova with Makino’s industrial machine manufacturing technologies.

The partners have built a prototype of the LMJ machine; a beta-prototype will be ready for Spring 2012. The new machine, built by Makino and sold by Synova, can be ordered from now. Commercialization of the new LMJ machines will start in Japan with subsequent worldwide distribution.

Makino offers a range of precision metal-cutting and EDM production machinery. Learn more at www.makino.com.

Synova SA developed the Laser MicroJet technology, combining laser power with water. Learn more at www.synova.ch.

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