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February 15, 2012 -- Electronics materials supplier Engineered Material Systems released the DA-5045-2 and DA-5045-4 high-thermal-conductivity die attach adhesives for light emitting diodes (LEDs) and small power semiconductor die packaging.
The new thermally and electrically conductive adhesives enable high thermal transfer for LEDs and power electronics. Thermal conductivities are greater than 20 W/mK when measured by laser flash. Both products feature high glass transition temperatures (Tg) and modulus, enabling wire bonding. They are electrically conductive for static drain. DA-5045-2 and -4 withstand JEDEC level 1/260°C reliability standards in LED packaging applications.
DA-5045-2 is currently used to assemble LED packages for automotive lighting.
DA-5045-2 and DA-5045-4 are the latest additions to Engineered Material Systems’ extensive line of electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonic applications.
Engineered Materials Systems, Inc. (EMS) provides electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonics assembly product lines. For more information, visit www.conductives.com.
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