February 17, 2012 -- The International Electronics Manufacturing Initiative (iNEMI) will hold the industry kick-off for its 2013 Roadmap in an open workshop immediately following IPC APEX EXPO in San Diego, CA, March 1-2.

Also read: 2011 ITRS: DRAM, 3D Flash, MEMS, nano scaling steal the show

The day-and-a-half workshop will begin with a review of the product sector key attribute spreadsheets, followed by break-out meetings of the technology groups as they begin the process of identifying technology and infrastructure needs for the electronics manufacturing supply chain. Packaging attendees will be interested in the Packaging & Component Substrates chapter of the roadmap especially.

Membership is not required to participate in the roadmap; non-member participation is encouraged to ensure a broad and accurate perspective of the supply chain.

The iNemi roadmap highlights processes and capabilities that will be needed for future products, including disruptive and emerging technologies. Every 2 years, the Roadmap is mapped out to identify key gaps in technology and infrastructure, R&D needs, and other activities needed for advanced electronics supply chains.

Check out the 2011 Roadmap: MEMS, 3D packaging major factors in iNEMI roadmap

Efforts are organized into Product Emulator Groups (PEGs) and Technology Working Groups  (TWGs).  The PEGs, each chaired by a major OEM in the specific sector covered, define the future technology needs of “virtual products.” Since product sector OEMs cannot share specific product information, they list “key attribute needs” in an “emulator” spreadsheet that covers the 10-year horizon of the roadmap and contains more 250 different entries per year. These key attributes are also combined into a summary spreadsheet that allows the user to quickly determine which product sector is driving each attribute.   

The TWGs identify trends for numerous technology and infrastructure areas, and contrast those trends with anticipated product needs. Composed of experts from OEMs, EMS providers, suppliers, government agencies, universities and related consortia/trade associations, the TWGs predict the evolution of technology and/or business practices, identify gaps and “showstoppers” in existing technology and infrastructure, and develop recommendations for their respective areas.

For a list of the 2013 PEGs and TWGs, go to http://www.inemi.org/2013-roadmap

The International Electronics Manufacturing Initiative’s (iNEMI) mission is to forecast and accelerate improvements in the electronics manufacturing industry for a sustainable future.  For additional information about iNEMI, go to http://www.inemi.org