Print
Email
Save
February 21, 2012 -- The 2012 IMAPS Device Packaging Conference will take place March 6-8 in Fountain Hills, AZ, with sessions on 2.5/3D packaging, flip chip and wafer level packaging (WLP), micro electro mechanical systems (MEMS), high-brightness light-emitting diodes (HB-LEDs), and passive integration.
Dr. Robert Darveaux, SVP of Technology & Platform Development, Amkor Technology Inc., will keynote Flip Chip & Wafer Level Packaging with "Escalating Challenges in Developing Complex Solutions for Next Generation Package and Interconnect Technologies."
Amkor is also presenting in the technical sessions. IMAPS Device Packaging includes sessions, panel discussions, a poster session, professional development courses and a vendor exhibition and technology showcase.
To register or get more information on the show, visit WWW.IMAPS.ORG/DEVICEPACKAGING
Visit Amkor Technology at BOOTH #37.
Subscribe to Solid State Technology/Advanced Packaging
Follow Advanced Packaging on Twitter.com by clicking www.twitter.com/advpackaging. Or join our Facebook group
