February 2, 2012 - BUSINESS WIRE -- 3M launched a high-capacitance Embedded Capacitance Material (ECM), targeting improved power integrity and reduced electromagnetic interference (EMI) for small form factor computer hardware, high-performance RF boards, microphones, integrated circuit (IC) packaging, and consumer electronics. The ECM material contributes to hi-fidelity signals, high-signal-to-noise ratio in radio frequencies, and higher speed digital signals.
Previous 3M ECM versions have a maximum capacitance density of approximately 10nF/inch2. The 3M ECM High-Capacitance Density products offer a 20-40nF/inch2 capacitance density range. The ECM material is halogen-free and RoHS compliant.
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The material matches the needs of increased fidelity and rapid miniaturization in electronic devices, said Abhay Joshi, global business development manager, 3M Electronic Solutions Division, Interconnect Business.
3M’s line of ECM material offerings can be embedded into printed circuit boards (PCBs) and IC chip packages where the applications include decoupling and low-pass filtering. Microphone makers can use the high-capacitance density offering to miniaturize their components.
3M Electronic Solutions Division’s Interconnect business offers a variety of innovative connectors, cables and cable assemblies, embedded capacitance materials and Textool brand test and burn-in sockets for component engineers and designers in the electronics industry. Visit www.3M.com/ecm.