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January 11, 2012 -- Zymet introduced the CN-1736 reworkable underfill encapsulant for 0.4mm-pitch package-on-package (PoP) assemblies.
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| Figure. Void-free underfill of 0.4-mm pitch POP with CN-1736. |
The underfill boasts low viscosity and a lower CTE than its predecessors, and greater flux compatibility. The 650cps viscosity enables optimized flow speed with finer pitch devices. The CTE of 55 ppm/°C protects finer-pitch solder joints from underfill-induced thermal cycle failure. Rework is accomplished at 170-180°C.
Zymet manufactures microelectronic and electronic adhesives and encapsulants, including die attach adhesives, substrate adhesives, UV curable glob top and cavity-fill encapsulants, and underfill encapsulants. Learn more at www.zymet.com.
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