January 10, 2012 - Marketwire -- Teledyne Microelectronic Technologies, a business unit of Teledyne Technologies Incorporated, will expand its optical packaging portfolio in a partnership with Zephyr Photonics. The companies will package Zephyr Photonics' proprietary vertical-cavity surface-emitting laser (VCSEL) technology with Teledyne Microelectronics Technologies' multi-chip module (MCM) and fiber optic assembly technologies.
The companies' resulting optical interconnect technologies will meet bandwidth and harsh-environment requirements for defense, aerospace, commercial aviation, and oil and gas applications. Zephyr Photonics' proprietary high-temperature VCSELs can withstand temperatures over 155°C. The advanced optical interconnect fiber optic products will enable data communications in national security and commercial applications.
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The agreement includes joint product development addressing future opportunities, a collaborative sales channel reaching more customers and new markets via Teledyne's multiple divisions, and unification for government funding proposals on new technologies.
Zephyr Photonics recently transitioned to a commercial enterprise after more than 25 years as a research and development company. This is its first commercial partnership. Tom Steding, CEO of Zephyr Photonics, praised the credibility and trustworthiness gained by working with Teledyne Microelectronic Technologies.
The benefit for Teledyne Microelectronic Technologies is expanding its range of optoelectronic packaging solutions. Albert Andry, VP and GM of Teledyne Microelectronic Technologies, notes that the Zephyr Photonics manufacturing and development partnership takes Teledyne's fiber optic packaging capabilities into the oil and gas sector.
Zephyr Photonics (formerly OptiComp) is focused on providing the Department of Defense, and the aerospace, industrial, energy, and intelligence industries products. Zephyr Photonics has independently developed its first commercial solution, a patented VCSEL technology for optoelectronic modules. For more information, visit www.zephyrphotonics.com.
Teledyne Microelectronics Technologies, a Department of Defense (DoD) Trusted Source for microelectronics, provides multichip modules (MCMs) and custom microelectronics packaging. Its parent company, Teledyne Technologies, provides sophisticated instrumentation, digital imaging products and software, aerospace and defense electronics, and engineered systems. For more information on Teledyne Microelectronics Technologies, visit www.teledynemicro.com.