January 31, 2012 -- CEA-Leti launched a major new platform, Open 3D, that provides industrial and academic partners with a global offer of mature 3D packaging technologies for their advanced semiconductor products and research projects.

The Open 3D platform includes Leti’s "off-the-shelf" 3D technologies -- design and layout; technologies including interconnections, through silicon vias (TSV), and components assembly; as well as reliability tests and final packaging for components or systems. It allows users to achieve proof of concept with few wafers, or prototyping with a larger quantity. The offer is based on limited mature technologies to ensure moderate costs, short cycle times, and performances corresponding to the initial technical requirements of Leti customers.

Figure 1. The Open-3D offer from CEA-Leti.

3D semiconductor packaging can offer performance, form factor, and cost benefits to bio/medical, aeronautics and space, consumer applications, defense and security, or fundamental research.

Open 3D also operates directly on active wafers with embedded components or on passive wafers for interposer technologies.

Open 3D partners will include laboratories, universities and international research institutes as well as fabless chip companies and niche market manufacturers and integrators, noted Laurent Malier, CEO of Leti.

Operated on the Minatec Campus in Grenoble with Leti teams and technological platforms, Open 3D is fully operational for 200mm wafers and will be operational in 2012 for 300mm wafers. Modules offered in the platform’s technology catalogue include:

• Through silicon vias (TSV) with aspect ratios to 1:3
• Interconnects for chips to wafers based on micro-bumps technology
• Interconnects for chips to substrates based on bumps technology
• Redistribution layers (RDL)
• Under-bump metallurgy (UBM)
• Temporary bonding, thinning and debonding
  

Figure 2. The Open-3D catalog offerings of 3D packaging technologies. SOURCE: CEA-Leti.

The technology catalog will be regularly enriched with new technological modules that correspond with new 3D mature technologies and customer requirements.

Also read: CEA-Leti improves MEMS reliability with new packaging, ruthenium and CEA-Leti, IPDiA partner on 3D integration for passives on Si

CEA is a French research and technology organization, with activities in four main areas: energy, information technologies, healthcare technologies and defence and security. Within CEA, the Laboratory for Electronics & Information Technology (CEA-Leti) works with companies to increase their competitiveness through technological innovation and transfers. CEA-Leti is focused on micro and nanotechnologies and their applications.

Contact: open_3D@cea.fr

Website: http://www.leti.fr/en/How-to-collaborate/Collaborating-with-Leti/Open-3D

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