Packaging 2012 P
-
05/14/2012 -- ASMPT integrates European business with SIPLACE organization
Asia-based ASM Pacific Technology (ASMPT) Group, a supplier of semiconductor assembly, bonding, and packaging equipment, will integrate with the SIPLACE organization in Europe. -
05/03/2012 -- GaN Systems collaborates with APEI to optimize power electronics packaging
GaN Systems and Arkansas Power Electronics International will co-develop a high-temperature, high-performance package optimized for gallium nitride (GaN) transistors and diodes. -
05/03/2012 -- Nitto Denko transfers semiconductor encapsulant business to Hitachi Chemical
Nitto Denko Corporation approved a transfer of its semiconductor encapsulating materials business to Hitachi Chemical Co. Ltd. -
05/03/2012 -- High-power semiconductor test contactor hits 500 Amperes
Multitest introduced the ecoAmp Kelvin contactor for high-power device test of 500+ Amperes. It meets the needs of high voltage/high current test with high thermal and mechanical stability. -
04/26/2012 -- GLOBALFOUNDRIES installs TSV fab tools for 20nm stacked die
At its Fab 8, GLOBALFOUNDRIES is installing a special set of production tools to create TSV in 20nm wafers. 3D die stacking of leading-edge chips will enable mobile and consumer electronics. -
04/25/2012 -- One-piece jetting cartridge for semiconductor packaging inspired by ink jet designs
Nordson ASYMTEK uncrated the NexJet System for jetting, with a newly designed jet cartridge and new software control for semiconductor packaging applications. -
04/24/2012 -- NXP increases pad pitch while shrinking package form factor
NXP Semiconductors released the new SOT1226 "Diamond" package using a “unique pad pitch design” to shrink the package by 25% from the prior design, with a 0.5mm pad pitch, 50% larger than typical small package designs. -
04/23/2012 -- Aeroflex brings test line-up to Qualcomm customers
Aeroflex will supply manufacturing test technology for radio frequency (RF) devices at Qualcomm customers, under a new licensing agreement with Qualcomm. -
04/19/2012 -- Mold packaging meets metal TSV for 5-10x density of conventional substrates
Silex Microsystems brought its Met-Via full-wafer-thickness TSV technology into Chip Architectures by Joint Associated Labs for European Diagnostics, where it is being used to create cost-effective molded chip-level packaging with through metal vias. -
04/19/2012 -- Ultratech brings former member back to Board
Ultratech, lithography and laser-processing system supplier to semiconductor manufacturers and packaging providers, added Michael C. Child to its Board of Directors. Child served on Ultratech’s Board in the 1990s.
Editors' Picks
TOP BLOG POSTS
Intel Foundries MEMS for Fuel Cell Start-up Nectar
IFTLE 134 SEMI 3D European Summit – Is the Wide IO Driver Dead?
EUV source roadmaps: Physics vs Engineering
Intel details 22nm trigate SoC process at IEDM
IFTLE 128: RTI 3D ASIP Part 1; Lester the Lightbulb update
Questions and answers on FD-SOI
GlobalFoundries takes on Intel with 14nm finFET “eXtreme Mobility” process
LIVE NEWS FEED
Advanced Packaging Recent Articles
Packaging Topics
| Materials |
NEW PRODUCTS
|
3M announces QDEF; to bring 50% more color to LCD devices
May 21, 2013
3M announced today it is in the final stages of scale-up for its new 3M Quantum Dot Enhancement Film (QDEF). The new film allow...
|
|
COMSOL Multiphysics 4.3b offers new additions to simulation platform
May 16, 2013
COMSOL Inc., a multiphysics simulator software developer, recently announced the release of major new additions to the COMSOL s...
|
|
Spectra-Physics introduces industrial picosecond laser
May 10, 2013
Spectra-Physics, a Newport Corporation brand, introduces Spirit ps 1040-10, an industrial-grade picosecond laser for precision ...
|
|
Multitest announces ecoAmp for high-power applications
May 8, 2013
Multitest announces that its ecoAmp high power Kelvin contactor successfully passed a challenging evaluation for an automotive ...
|
