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Packaging

Lockheed Martin develops new Cu solder

KIT develops "photonic wire bond" for optical chip connections

Semiconductors

Deca tips new M-Series chip-scale packaging offering

Why the new Windows 8 won't spur DRAM sales

LEDs

SUSS buys Tamarack for lithography, laser structuring lines

K&S capillary specifically suits LED wire bonding

Displays

Indium expands electronics materials manufacturing with new facility in NY

Declining display costs lower large tablet prices in 2016

Editors Picks

EVG updates modular coater/developer with OmniSpray, NanoSpray coating options

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