July 8, 2011 -- SET - Smart Equipment Technology - will introduce the FC300R robotic device bonding platform at SEMICON West, July 12-14 in San Francisco, CA. The FC300R performs chip-to-substrate bonding, chip-to-wafer assembly, and chip-to-chip stacking for flip chip, through silicon via (TSV), and other advanced packaging processes.

The FC300R uses a loading robot added to the base of an FC300 bonding tool to increase component handling capabilities with substrates and waffle packs/GELPAKs, which the machine can store in large quantities. The tool accommodates components from 150 x 150µm to 100 x 100mm and substrates up to 200 x 200mm, or 300mm wafers. Options include a direct die feeder from diced wafer on frame, capable of handling thin die, and a tape and reel feeder. The robotic system protects fragile electronics materials like GaAs and HgCdTe.

The loading robot operates in parallel with the bonding process and up to three pre-alignment and inspection optics subsystems in the robotic feeding area. Image processors enable pattern search, synthetic pattern generation, edge detection, calipers, and contrast enhancement.

Post-bonding accuracy is in the submicron range at 0.4N to 4000N bonding forces. Optional bonding technologies include an ultrasonic bonding head and a high-force bonding head with confinement chamber to reduce bump and bonding pad oxidation. SET recommends the high-force bonder for copper-to-copper bonding in 3D ICs. Other bonding capabilities include low-force reflow bonding for optoelectronics, RF, and other components and a UV cure for adhesives and UV nano-imprint lithography (UV-NIL). Users can perform fluxless reflow, adhesive joining, thermosonic, thermo-compression and direct metallic bonding.

A major global semiconductor company has ordered the FC300R for 3D bonding applications, noted Gilbert Lecarpentier, director of marketing & business development.

SET will debut the system at SEMICON West booth 6381, North Hall, Moscone Center, San Francisco, CA.

SET - Smart Equipment Technology - makes high-accuracy die-to-die and die-to-wafer bonders and nanoimprint lithography tools. Learn more at www.set-sas.fr.

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