July 13, 2011 -- Henkel Electronic Materials introduced a silver (Ag) sintering technology that enables high-volume power package production without pressure bonding. The technology is designed into Henkel’s Ablestik SSP2000 die-attach material, suiting IGBTs and high power LED (HB-LED) packaging.
Conventional silver sintering requires heat and pressure to form interconnects in the device. Henkel’s new technology avoids pressure processing because the silver particles are joined via a unique surface tension mechanism. This eliminates single-package processing in a dedicated die bonder; the material can be cured in a standard batch oven at 200°C or higher. Ablestik SSP2000 can be processed on standard die bonding systems. Henkel says that the typical silver sintering die bond process outputs 30 packages an hour. Using the Ablestik SSP2000 can bring throughput up to 6000 units per hour, said Dr. Michael Todd, VP of product development and engineering.
Ablestik SSP2000 also boasts better thermal conductivity and resistance, and power cycling reliability than high-lead soft solders: power cycle testing showed that solder failed at 200 cycles and Henkel’s Ag sintering technology topped 2,000 cycles. Since the sintering process is lead-free, it meets the RoHS requirement for the elimination of lead-based materials from the power device market by 2014.
Also read: HB LED packaging materials pros and cons with Henkel's Daniel Duffy
Henkel operates worldwide with leading brands and technologies in three business areas: Laundry & Home Care, Cosmetics/Toiletries, and Adhesive Technologies. Learn more at www.henkel.com/electronics
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