December 15, 2011 -- Licensing company Rambus Inc. (Nasdaq:RMBS) is engaging with the Industrial Technology Research Institute (ITRI) in Taiwan on the development of interconnect and 3D packaging technologies.
Initially, the companies will collaborate on the development of system integration using silicon interposer technology. Rambus joined the Advanced Stacked-System Technology and Application Consortium (Ad-STAC), a multinational research association led by ITRI. As Ad-STAC members, Rambus and ITRI will share ITRI’s strength in manufacturing and advanced process technologies as well as the strong system, package and signaling design experience of Rambus.
"This collaboration brings together Rambus’ advanced high-bandwidth and low-power device designs and ITRI’s know-how in fabrication with our 12" [300mm] equipment," said Dr. Ian Chan, VP and general director of the Electronics and Optoelectronics Research Laboratories at ITRI.
ITRI is a national research organization that serves to strengthen the technological competitiveness of Taiwan. Learn more at www.itri.org.tw.
Rambus is a premier technology licensing company. Additional information is available at www.rambus.com.
Recently, Singapore's A*STAR Institute of Microelectronics (IME) and 3D IC developer Tezzaron Semiconductor signed a research collaboration agreement to develop and exploit advanced through silicon interposer (TSI) technology. Read about this silicon interposer partnership here.
Subscribe to Solid State Technology/Advanced Packaging